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Temasek closes Public Offer of 2.70% 5-year T2023-S$ Temasek Bond

  • T2023-S$ is first Temasek Bond with retail tranche
  • Fixed interest rate of 2.70% per annum over 5 years
  • Public Offer just over 8 times subscribed, with just over S$1.6 billion of valid applications received
  • Allocation basis will be announced by tomorrow evening

 

Singapore, 23 October 2018, 5.30pm – Temasek Holdings (Private) Limited (“Temasek”) refers to the announcement on Tuesday 16 October 2018 regarding the offer of the T2023-S$ Temasek Bond, comprising up to S$400 million 2.70% guaranteed notes due 2023 (subject to the Upsize Option), to be issued through its wholly-owned subsidiary Temasek Financial (IV) Private Limited.

Close of the Public Offer

The Public Offer closed on Tuesday 23 October 2018 at 12 noon.

 As at the close of the Public Offer of up to S$200 million, valid applications received totalled S$1,675,700,000 representing a subscription rate of just over 8 times the Public Offer.

An allocation process will take place following the close of the Public Offer. The results of the allocation process will be announced by tomorrow evening.

Further information will be shared at that time on the listing and trading of the T2023-S$ Temasek Bond on the SGX-ST, and the refunds of application monies for applications that were not successful.

This announcement will be posted on Temasek’s website at www.temasek.com.sg and on the website of the SGX-ST.

Not for distribution within the United States or to U.S. Persons
This announcement is not an offer of securities for sale in the United States. Securities may not be offered or sold in the United States absent registration or an exemption from registration under the U.S. Securities Act of 1933, as amended. No portion of the proposed offering is intended to be registered in the United States, and no offering is intended to be conducted in the United States. The T2023-S$ Temasek Bond may not be offered or sold within the United States or to, or for the account or benefit of, U.S. persons.

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Contact Us

For general enquiries, please contact us at bond@temasek.com.sg

 

For media queries, please contact:

Paul EWING-CHOW

Associate Director, Public Affairs, Temasek

Tel: +65 6828 6651

Email: paulewingchow@temasek.com.sg

 

 

For investor queries, please contact:

CHONG Hui Min

Director, Investor Relations, Temasek

Tel: +65 6828 2468

Email: huimin@temasek.com.sg

 

 

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